Surface mount package with heat transfer feature

Details Surface mount package with heat transfer feature Surface mount package with heat transfer feature

1996-05-21

1997-10-21

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257 81, 257 82, 257173, 257275, 257276, 257290, H01L 3300, H01L 3112, H01L 2302

Patent

active

056799799

ABSTRACT:
A package (1) for diodes (6) is constructed with a substrate (2) of alumina, a common area (5) on which diodes (6) are mounted, bond wires (8) extending from respective diodes to connect with respective conducting output areas (9) respective vias (13) connecting the common area (5) and the output areas (9) to respective surface mount pads (14, 18) on a bottom surface of the substrate (2), heat spreading areas (19) on the top surface of the substrate (2), and multiple conducting vias (13) connecting each of the heat spreading areas (19) to a heat conducting, surface mount, ground pad (20) on the bottom surface of the substrate (2).

REFERENCES:
patent: 3745423 (1973-07-01), Kasano
patent: 4847848 (1989-07-01), Inoue et al.
patent: 5014159 (1991-05-01), Butt
patent: 5045914 (1991-09-01), Casto et al.
patent: 5132875 (1992-07-01), Plesinger
patent: 5227646 (1993-07-01), Shigeno
patent: 5262927 (1993-11-01), Chia et al.
patent: 5280409 (1994-01-01), Selna et al.
patent: 5423358 (1995-06-01), Nelson et al.
patent: 5459356 (1995-10-01), Schulze et al.
patent: 5463250 (1995-10-01), Nguyen et al.
patent: 5513070 (1996-04-01), Xie et al.
patent: 5532506 (1996-07-01), Tserng

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