Polyimide resin compositions

Details Polyimide resin compositions Polyimide resin compositions

1990-05-31

1991-08-20

Kight, III, John

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From silicon reactant having at least one...

528 26, 528 28, 528 30, 528 33, 528 38, 525433, 525474, C08F28312, C08G 7726, C08G 7738, C08L 8308

Patent

active

050415131

ABSTRACT:
A polyimide resin is prepared by polymerizing (A) a tetracarboxylic acid dianhydride component consisting essentially of 10 to 50 mol % of 2,2-bis(3,4-benzene-dicarboxylic anhydride)perfluoropropane and 90 to 50 mol % of pyromelitic dianhydride or similar acid dianhydride and (B) a diamine component consisting essentially of 10 to 80 mol % of a silicon diamine and 90 to 20 mol % of an ether diamine. The polyimide resin is soluble in ordinary organic solvents to form solutions which are readily applicable to substrates, typically providing insulating protective coatings on electronic parts.

REFERENCES:
patent: 4588804 (1986-05-01), Fryd
patent: 4818806 (1989-04-01), Kunimune et al.

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