Method for extracting electrode and cantilever for AFM using sai

Details Method for extracting electrode and cantilever for AFM using sai Method for extracting electrode and cantilever for AFM using sai

1996-02-06

1997-10-21

Williams, Hezron E.

Measuring and testing

Surface and cutting edge testing

Roughness

G01B 528, G01N 2300

Patent

active

056798890

ABSTRACT:
A method for extracting electrodes, comprises the steps of forming an electrode of a dielectric thin film on a first substrate member, forming a small projection on a second substrate member, forming a wiring pattern of an electrode extracting member communicating with the projection on the second substrate member, whereby the electrode extracting member on the projection constitutes a projection portion and the electrode of the first substrate member is brought into contact with the projection portion to the electrode extracting member on the second substrate member, whereby the electrode can be electrically connected to an external unit via the electrode extracting member.

REFERENCES:
patent: 5268571 (1993-12-01), Yamamoto et al.
patent: 5276672 (1994-01-01), Miyazaki et al.
patent: 5537863 (1996-07-01), Fujiu et al.
patent: 5546375 (1996-08-01), Shimada et al.

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