Thermosetting resin composition, printed circuit board using the

Details Thermosetting resin composition, printed circuit board using the Thermosetting resin composition, printed circuit board using the

1989-09-27

1991-09-03

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

4284228, 428457, 428901, 361397, 361398, 156 60, 427 96, 264104, B32B 900

Patent

active

050453815

ABSTRACT:
A thermosetting resin composition which comprises a cyanate compound or an isocyanate compound represented by the following general formula (I):

REFERENCES:
patent: 4774634 (1988-09-01), Tate et al.

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