Semiconductor device having grid for plating contacts

Details Semiconductor device having grid for plating contacts Semiconductor device having grid for plating contacts

1978-05-05

1980-05-06

James, Andrew J.

357 42, 357 55, 357 68, H01L 2980, H01L 2710, H01L 2966

Patent

active

042020018

ABSTRACT:
A semiconductor device includes a body of semiconductor material on which are formed a plurality of spaced semiconductor elements. Each of the semiconductor elements includes a plurality of contacts, some of which are separated from each other by recesses in the semiconductor body. A metal grid is on the semiconductor body and surrounds each of the semiconductor elements. At least one of the contacts of each element extends to and is connected to the grid. The grid serves to electrically connect the contacts of all the semiconductor elements to permit the electrical plating of the contacts. Those contacts of each semiconductor element which are not directly connected to the grid are electrically connected thereto through the semiconductor body and an adjacent contact which is directly connected to the grid.

REFERENCES:
patent: 3484662 (1969-12-01), Hagon
patent: 3749985 (1973-07-01), Dawson
patent: 3790825 (1974-02-01), Barron et al.
patent: 3894295 (1975-07-01), Shannon et al.
patent: 3969745 (1976-07-01), Blocker
patent: 3997908 (1976-12-01), Schloetterer
patent: 4015278 (1977-03-01), Fukuta
patent: 4038563 (1977-07-01), Zuleeg et al.
patent: 4069493 (1978-01-01), Bobenrieth
patent: 4084173 (1978-04-01), Fantechi
patent: 4104672 (1978-08-01), Dilorenzo et al.

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