Fishing – trapping – and vermin destroying
Patent
1990-04-05
1991-08-20
Chaudhuri, Olik
Fishing, trapping, and vermin destroying
437217, 357 70, 357 72, 357 80, H01L 2156, H01L 2158, H01L 2160
Patent
active
050413953
ABSTRACT:
The disclosure concerns the encapsulation of integrated circuit chips, notably with a view to their being incorporated in a chip card. The encapsulation method comprises the formation of a pre-punched metallic conductive grid, the formation of a strip of pre-perforated plastic material, the transfer of a strip to the grid, the positioning of an integrated circuit chip in a perforation of the strip, and the formation of electrical connections between the chip and zones of the grid located in perforations of the strip. The perforations of the strip and the punched slots of the grid are arranged so that the strip covers and blocks all the interstices between conductors of the grid in the useful region corresponding to a module to be made. When a protecting resin is laid, it is confined and does not leak through the interstices of the grid. A plastic or metal ring defines the heightwise dimension of the micromodule.
REFERENCES:
patent: 4100675 (1978-07-01), Landsittel
patent: 4549247 (1985-10-01), Hoppe et al.
patent: 4674175 (1987-06-01), Stampfli
IBM Technical Disclosure Bulletin, vol. 24, No. 2, 7-81 (29/840), "Flexible Tape Interconnection for Chips", L. V. Avletta & R. Marks.
Chaudhuri Olik
Graybill David E.
Plottel Roland
SGS-Thomson Microelectronics S.A.
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