Solder paste dispenser for SMD circuit boards

Coating apparatus – Program – cyclic – or time control – Having prerecorded program medium

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Details

118410, 222260, B05C 502

Patent

active

045721033

ABSTRACT:
A device for discretely controlled deposition of very small quantities of a viscous fluid at each of a succession of locations according to a digital X-Y-Z program. The primary application is for deposition of a slurry of small solder particles in a viscous fluid such as, for example, an organic acid RMA standard flux on a programmed succession of conductive pads or loci on or above the surface of a typical SMD circuit board.
A pumping valve driven by pneumatic pressure effects a uniform deposition during the dwell time at each location. A free-piston syringe driven by pneumatic pressure supplies the slurry to a chamber within the pumping valve barrel which feed a small orifice (such as from a hypodermic needle). A pancake pneumatic cylinder controls the up-down motion of a rod acting as a piston to drive the predetermined uniform amount of slurry through the orifice on its down-stroke, the up-stroke aiding in the formation of a "fluid-sheer" cone of the deposited viscous material.

REFERENCES:
patent: 2567201 (1951-09-01), Goepfert
patent: 3731648 (1973-05-01), Gerber et al.
patent: 3785898 (1974-01-01), Gerber et al.

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