Semiconductor device

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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361808, H05K 100

Patent

active

052507602

ABSTRACT:
A semiconductor device of a multilayer interconnection structure which includes a plurality of insulating layers and a plurality of metal interconnection layers. The uppermost metal interconnection layer is formed in a hall in the uppermost interlayer insulating layer. The uppermost interconnection layer is formed as a bonding pad portion and a part of the layer is formed into a ring-shaped portion so as to cover the side portion of the hall.

REFERENCES:
patent: 4872050 (1989-10-01), Okamoto et al.

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