Semiconductor encapsulating epoxy resin compositions and semicon

Details Semiconductor encapsulating epoxy resin compositions and semicon Semiconductor encapsulating epoxy resin compositions and semicon

1992-11-25

1993-10-05

Bleutge, John C.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525482, 525527, 528103, 528402, C08F28310

Patent

active

052506371

ABSTRACT:
An epoxy resin composition comprising an epoxy resin, a curing agent and an inorganic filler is adapted for semiconductor encapsulation. A fluorinated organic silicon compound is blended in the composition as a coupling agent whereby the composition is improved in adhesion and moisture resistance.

REFERENCES:
patent: 4042550 (1977-08-01), Tuller et al.
patent: 4122246 (1978-10-01), Sierawski
patent: 4156046 (1979-05-01), Lien et al.
patent: 5141802 (1992-08-01), Parrinello et al.

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