Fabrication of leads on semiconductor connection components

Details Fabrication of leads on semiconductor connection components Fabrication of leads on semiconductor connection components

1995-05-04

1997-10-21

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29827, 216 14, 216 20, H05K 340

Patent

active

056791941

ABSTRACT:
A substantially continuous layer of a first metal such as copper is provided with strips of a second metal such as gold by selective electroplating of the second metal. A dielectric support layer is provided in contact with the first metal layer, and the first metal layer is etched to leave strips of the first metal contiguous with the strips of the second metal, thereby providing composite leads with the first and second metal strips connected in series. The process provides simple end economical methods of making microelectronic connection components with leads having a flexible, fatigue resistant lead potion formed from a precious metal.

REFERENCES:
patent: 3024151 (1962-03-01), Robinson
patent: 3129280 (1964-04-01), Elarde
patent: 3350498 (1967-10-01), Leeds

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