Method for manufacturing a semiconductor device with corrosion r

Details Method for manufacturing a semiconductor device with corrosion r Method for manufacturing a semiconductor device with corrosion r

1992-01-29

1993-10-05

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437220, H01L 2156, H01L 2158, H01L 2160

Patent

active

052504700

ABSTRACT:
A method for manufacturing semiconductor device comprising a semiconductor element having pads, a supporting member having a mount region on which the semiconductor element is mounted, and a plurality of leads pattern-formed on the supporting member. Each of the leads has a first end positioned near the mount region, and a second end. Conductors are provided for connecting the first ends of the leads to the pads of the semiconductor elements. Sealing material is provided for sealing at least the conductors, the semiconductor element and the second ends of the plurality of leads. The second ends of the leads are collected together in a branch area arranged along the circumference of the supporting member.

REFERENCES:
patent: 3778887 (1973-12-01), Suzuki et al.
patent: 4806409 (1989-02-01), Walter et al.
patent: 4843225 (1989-06-01), Hoppe
patent: 4860087 (1989-08-01), Matsubara et al.
patent: 4962415 (1990-10-01), Yamamoto et al.
patent: 5036380 (1991-07-01), Chase
"IC Card" Terada, K. K. Nihon Kogyo Gi Jutsu Center, Mar. 28, 1986, pp. 132-159.

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