Optics: measuring and testing – By light interference – For dimensional measurement
Patent
1998-06-26
2000-12-26
Kim, Robert
Optics: measuring and testing
By light interference
For dimensional measurement
G01B 902
Patent
active
061668192
ABSTRACT:
A method for optically measuring layer thickness in accordance with the present invention includes the steps of providing a first metal layer on a semiconductor device structure, providing a second metal layer on the first metal layer, forming a dielectric layer over the second metal layer and directing light onto the structure such that light reflected from a surface of the dielectric layer and a surface of the second metal layer create an interference pattern from which the dielectric layer thickness is measured. A system for optically measuring layer thickness includes a semiconductor device to be measured. The semiconductor device includes a first metal layer, a second metal layer disposed on the first metal layer, the second metal layer having an arcuate shaped top surface and a dielectric layer disposed on the second metal layer. A means for directing and receiving light is also included wherein light is directed onto the semiconductor device such that light reflected from a surface of the dielectric layer and a surface of the second metal layer creates an interference pattern from which the dielectric layer thickness is measured.
REFERENCES:
patent: 4984894 (1991-01-01), Kondo
patent: 5473431 (1995-12-01), Hollars et al.
Kim Robert
Lee Andrew H.
Siemens Aktiengesellschaft
LandOfFree
System and methods for optically measuring dielectric thickness does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with System and methods for optically measuring dielectric thickness , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and methods for optically measuring dielectric thickness will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1001220