4. Turning
  5. Radially moving rotating tool inside bore

Yuuji Watanabe

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Method for forming solder bumps

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Tool holding apparatus having cutting edge moving function

Turning – Radially moving rotating tool inside bore
Patent

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Profile ID: LFUS-PAI-P-668610

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