4. Measuring and testing
  5. Vibration
  6. By mechanical waves

Yosinori Musha

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Stress evaluation method and apparatus therefor

Measuring and testing – Vibration – By mechanical waves
Patent

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Stress evaluation method and apparatus therefor

Measuring and testing – Vibration – By mechanical waves
Reexamination Certificate

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Ultrasonic imaging system of bonding zone

Measuring and testing – Vibration – By mechanical waves
Patent

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Profile ID: LFUS-PAI-P-277430

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