4. Amplifiers
  5. With semiconductor amplifying device
  6. Including distributed parameter-type coupling

Xiao-Peng Sun

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MMIC power amplifier with wirebond output matching circuit

Amplifiers – With semiconductor amplifying device – Including distributed parameter-type coupling
Reexamination Certificate

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Multi-layer interconnect module and method of interconnection

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2497798

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