4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Incorporating resilient component

Woon Ky Ha

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Memory card

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Method for fabricating a memory card

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Incorporating resilient component
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2142309

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