4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Of specified material other than unalloyed aluminum

William Patrick

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Die hemming assembly and method

Metal deforming – By use of non-deforming work-gripping clamp and relatively... – With interrelated clamp closer and tool mover
Reexamination Certificate

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Electromechanical hemming apparatus and method

Metal deforming – By use of non-deforming work-gripping clamp and relatively... – Plural or complex apparatus
Reexamination Certificate

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Titanium nitride diffusion barrier for use in non-silicon...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2084678

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