4. Metal fusion bonding
  5. With means to remove, compact, or shape applied flux or filler
  6. By fluid blast or suction

William J. Kosslow

Inventor

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Inventor

active

Retractable pin dual in-line package test clip

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Smart radiological dosimeter

Radiant energy – Invisible radiant energy responsive electric signalling – Including a radiant energy responsive gas discharge device
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Soldering instrument safety improvements

Metal fusion bonding – With means to remove – compact – or shape applied flux or filler – By fluid blast or suction
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

William J. Kosslow does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with William J. Kosslow, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and William J. Kosslow will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-563735

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure