4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Wei-Sen Tang

Inventor

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Inventor

active

Flip-chip package structure and method of fabricating the same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Flip-chip package structure and method of fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Test method for VGA with overclock frequency and a VGA...

Computer graphics processing and selective visual display system – Display with fail/safe testing feature
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Wei-Sen Tang does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Wei-Sen Tang, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wei-Sen Tang will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-2078046

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure