4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Wan-Ling Yu

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Metallic bump structure without under bump metallurgy and...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Structure of embedded capacitor

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
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Profile ID: LFUS-PAI-P-2171429

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