4. Metal fusion bonding
  5. Process
  6. Using high frequency vibratory energy

Tomohiro Okazaki

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Semiconductor chip mounting method utilizing ultrasonic...

Metal fusion bonding – Process – Using high frequency vibratory energy
Reexamination Certificate

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Storage box for electronic apparatus

Acoustics – Sound-modifying means – Housing or enclosure
Reexamination Certificate

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Storage box for electronic apparatus

Acoustics – Sound-modifying means – Housing or enclosure
Reexamination Certificate

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Storage box for electronic apparatus

Acoustics – Sound-modifying means – Housing or enclosure
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2070869

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