4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package

Tomiji Sato

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LSI package and internal connecting method used therefor

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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LSI package with internal wire patterns to connect and mount...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2573972

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