4. Semiconductor device manufacturing: process
  5. With measuring or testing
  6. Packaging or treatment of packaged semiconductor

Todd G. Backer

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Process for manufacturing a semiconductor device bump electrode

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
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Soft adjacent layer vertically biased magnetoresistive sensor ha

Dynamic magnetic information storage or retrieval – Head – Hall effect
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Profile ID: LFUS-PAI-P-156086

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