4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Metallic housing or support

Tobita Masayuki

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Adhesion method and electronic component

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Heat conductive adhesive film and manufacturing method...

Stock material or miscellaneous articles – Composite – Of epoxy ether
Reexamination Certificate

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Heat conductive molded body and manufacturing method thereof...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2630734

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