4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With dam or vent for encapsulant

Tim Teoh

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U-shape tape for BOC FBGA package to improve moldability

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate

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U-shape tape for BOC FBGA package to improve moldability

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

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Profile ID: LFUS-PAI-P-2538239

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