4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Thomas B. Blount

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High density chip level package for the packaging of...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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High density chip level package for the packaging of...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2851188

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