4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Flip chip

Takatoyo Yamakami

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Design support system

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing
Reexamination Certificate

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Head assembly having integrated circuit chip covered by...

Dynamic magnetic information storage or retrieval – Head mounting – Disk record
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Head assembly, disk unit, and bonding method and apparatus

Metal fusion bonding – Means to apply vibratory solid-state bonding energy to work
Reexamination Certificate

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Head assembly, disk unit, and bonding method and apparatus

Metal fusion bonding – Means to apply vibratory solid-state bonding energy to work
Reexamination Certificate

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Magnetic head tester

Electricity: measuring and testing – Magnetic – Magnetic information storage element testing
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2516109

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