4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including adhesive bonding step

Takashi Suzumura

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Bulge forming method and apparatus

Metal deforming – By application of fluent medium – or energy field – With actuated tool engaging work
Patent

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Carrier and method of manufacturing carrier

Metal deforming – Process – Deforming sheet metal
Reexamination Certificate

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Composite material member for semiconductor device and...

Stock material or miscellaneous articles – All metal or with adjacent metals – Having metal particles
Reexamination Certificate

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Composite superconductors

Electricity: conductors and insulators – With fluids or vacuum – With cooling or fluid feeding – circulating or distributing
Patent

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Method for sticking an insulating film to a lead frame

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent

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Profile ID: LFUS-PAI-P-333953

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