4. Metal fusion bonding
  5. Process
  6. Plural joints

Steven Alfred Kummerl

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Bond capillary design for ribbon wire bonding

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Integrated circuit chip packaging assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Leadframe having delamination resistant die pad

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3024543

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