4. Metal fusion bonding
  5. Process
  6. With condition responsive, program, or timing control

Sreenivasan Koduri

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Wire bonding capillary having alignment features

Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent

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Wire bonding with capillary realignment

Metal fusion bonding – Process – With condition responsive – program – or timing control
Reexamination Certificate

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Wire bonding with capillary realignment

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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