4. Semiconductor device manufacturing: process
  5. Bonding of plural semiconductor substrates
  6. Subsequent separation into plural bodies

Sing-Chung S. Hu

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Silicon wafers for CMOS and other integrated circuits

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate

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Silicon wafers for CMOS and other integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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