4. Adhesive bonding and miscellaneous chemical manufacture
  5. Methods
  6. Surface bonding and/or assembly therefor

Seigo Oiwa

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Method for producing ceramic dielectrics

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
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Zirconia-added alumina substrate with direct bonding of copper

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Profile ID: LFUS-PAI-P-1759468

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