4. Acoustics
  5. Combined

Scott Tseng

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Multibay with unplugging/positioning mechanism

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Process for forming a patterned thin film structure for...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Delaminating – per se; i.e. – separating at bonding face
Reexamination Certificate

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Process for forming a patterned thin film structure for...

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Reexamination Certificate

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Structure of modem shell with round sound suppression

Acoustics – Combined
Patent

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Profile ID: LFUS-PAI-P-1250316

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