4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated

Scott Gooch

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Method and apparatus for reducing BGA warpage caused by...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Method and apparatus for reducing BGA warpage caused by...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Method and apparatus for reducing BGA warpage caused by...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Method of encapsulating semiconductor devices utilizing a...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate

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Semiconductor device encapsulators

Coating apparatus – Projection or spray type – Plural projectors
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2102557

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