4. Adhesive bonding and miscellaneous chemical manufacture
  5. Delaminating processes adapted for specified product
  6. Delaminating in preparation for post processing recycling step

Sankerlingam Rajendran

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Solid hermetic via and bump fabrication

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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System for forming patterns on a multi-curved surface

Data processing: generic control systems or specific application – Generic control system – apparatus or process – Digital positioning
Reexamination Certificate

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Wet-tip die for EFG crystal growth apparatus

Chemical apparatus and process disinfecting – deodorizing – preser – Chemical reactor – Including specific material of construction
Patent

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Wet-tip die for EFG cyrstal growth apparatus

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Profile ID: LFUS-PAI-P-1731551

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