4. Pulse or digital communications
  5. Synchronizers

Sang-Geun Kim

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Die bonding equipment

Metal fusion bonding – With control means responsive to sensed condition – Work-responsive
Reexamination Certificate

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Die bonding method for manufacturing fine pitch ball grid...

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Method for minimizing time to establish initial synchronization

Pulse or digital communications – Synchronizers
Patent

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Profile ID: LFUS-PAI-P-191015

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