4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including adhesive bonding step

Sally Y. L. Foong

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Mechanical clamper for heated substrates at die attach

Metal fusion bonding – Including means to force or clamp work portions together... – Work portion comprises electrical component
Reexamination Certificate

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Method and apparatus for handling thin semiconductor wafers

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate

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Using removable spacers to ensure adequate bondline thickness

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2449335

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