4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With structure for mounting semiconductor chip to lead frame

Saat Shukri Embong

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active

Ball-less clip bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Leadframe, method of manufacturing a leadframe, and method of pa

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Method for manufacturing a semiconductor package on a leadframe

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate

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Method for manufacturing an electronic device package

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Method of manufacturing a semiconductor component and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Profile ID: LFUS-PAI-P-978422

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