4. Metal fusion bonding
  5. Process
  6. Using high frequency vibratory energy

Rosa Lynda Nuno

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Method for ultrasonic bonding flexible circuits

Metal fusion bonding – Process – Using high frequency vibratory energy
Patent

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Solderless flip-chip assembly and method and material for same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1108150

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