4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With separate tie bar element or plural tie bars

Roberto U. Villanueva

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Exposed paddle leadframe for semiconductor die packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Molded shield structures and method for their fabrication

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Structure and method for securing a molding compound to a...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2538275

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