4. Electrical generator or motor structure
  5. Non-dynamoelectric
  6. Piezoelectric elements and devices

Raymond L. Sawin

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Acoustic device packaged at wafer level

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Encapsulation technology for saw device

Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices
Reexamination Certificate

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Method of encapsulating a saw device

Metal working – Piezoelectric device making
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2095184

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