4. Fluid handling
  5. Removable valve head and seat unit

Rachel K. Giunta

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Method of packaging and assembling micro-fluidic device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Packaging of electro-microfluidic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Packaging of electro-microfluidic devices

Fluid handling – Removable valve head and seat unit
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2460404

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