4. Semiconductor device manufacturing: process
  5. Bonding of plural semiconductor substrates
  6. Thinning of semiconductor substrate

Peter Hartwell

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Device isolation process flow for ARS system

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
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Device isolation process flow for ARS system

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Low workfunction layer for electron emission
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Multi-die apparatus including moveable portions

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
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Process flow for ARS mover using selenidation wafer bonding...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
Reexamination Certificate

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Process flow for ARS mover using selenidation wafer bonding...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2531749

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