Osamu Usuda

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Apparatus and method for manufacturing semiconductor device

Metal fusion bonding – Process – Plural joints
Patent

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Arcing horn device

Electricity: electrical systems and devices – Safety and protection of systems and devices – High voltage dissipation
Reexamination Certificate

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Semiconductor device

Equipment for production – distribution – or transformation of ene – Distribution – modification or control – Semiconductor – transistor or integrated circuit
Design Patent

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Semiconductor device

Equipment for production – distribution – or transformation of ene – Distribution – modification or control – Semiconductor – transistor or integrated circuit
Design Patent

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Semiconductor device having improved electrode pad structure

Patent

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Profile ID: LFUS-PAI-P-236723

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