4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Alignment marks

Nadia Yala

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active

Flip-chip assembly with thin underfill and thick solder mask

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Semiconductor device exhibiting enhanced pattern recognition...

Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks
Reexamination Certificate

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Textured dielectric patch antenna fabrication method

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Textured dielectric patch antenna fabrication method

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Underfill film for printed wiring assemblies

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2674393

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