4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Multiple housings

Myoung-Jin Shin

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Method for fabricating a stacked semiconductor chip package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Stacked semiconductor chips in a single semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2463229

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