4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated

Michitake Kuroda

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Method for manufacturing sensor device

Metal working – Method of mechanical manufacture – With testing or indicating
Reexamination Certificate

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Pressure sensor and method for manufacturing the same

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Pressure sensor having semiconductor sensor chip

Measuring and testing – Fluid pressure gauge – Diaphragm
Reexamination Certificate

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Resin sealing type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2021987

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