4. Adhesive bonding and miscellaneous chemical manufacture
  5. Methods
  6. Surface bonding and/or assembly therefor

Michael Connell

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Fabrication of stacked microelectronic devices

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Reexamination Certificate

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Fabrication of stacked microelectronic devices

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Micro-lens configuration for small lens focusing in digital...

Radiant energy – Photocells; circuits and apparatus – Photocell controlled circuit
Reexamination Certificate

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Micro-lens configuration for small lens focusing in digital...

Radiant energy – Photocells; circuits and apparatus – Photocell controlled circuit
Reexamination Certificate

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Stacked microelectronic devices and methods of fabricating same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2839001

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