4. Metal fusion bonding
  5. Process
  6. Using high frequency vibratory energy

Michael Bettinger

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Apparatus and method for providing mechanically pre-formed...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Apparatus and method for providing mechanically pre-formed...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Apparatus and method for providing mechanically pre-formed...

Metal deforming – By tool-couple embodying nonplanar tool-face – With complementary tool-faces
Reexamination Certificate

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Apparatus and method for providing mechanically pre-formed...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Apparatus for forming wire bonds from circuitry on a...

Metal fusion bonding – Process – Using high frequency vibratory energy
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Profile ID: LFUS-PAI-P-2053381

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