4. Recorders
  5. Thermal recording

Masato Kawanishi

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High-frequency module

Semiconductor device manufacturing: process – Semiconductor substrate dicing – With attachment to temporary support or carrier
Reexamination Certificate

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High-frequency module

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Reexamination Certificate

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Thermal head for thermal recording machine

Recorders – Thermal recording
Patent

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Thermal printing head manufacturing method

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Profile ID: LFUS-PAI-P-1739756

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